Annual Bloomberg Bucket Event 2013

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A silicon wafer, a thin slice of semiconductor material used in... Fotografia de notíciasAmérica do Norte,As Américas,Califórnia,Dispositivo de informação portátil,EUA,Fatia,Finanças,Fino,Horizontal,Internet,Irvine,Material,Sede Principal,Semicondutor,Silício,Tecnologia,Tecnologia sem FiosPhotographer Collection: Bloomberg 2013 BloombergA silicon wafer, a thin slice of semiconductor material used in integrated circuits, is displayed at the headquarters of Broadcom Corp. in Irvine, California, U.S., on Friday, April 12, 2013. Broadcom Corp. is a maker of chips that help mobile devices connect to the Internet. Photographer: Patrick T. Fallon/Bloomberg via Getty Images